Tuesday, May 24, 2022

Semiconductor packaging will take lead in supply chain localisation, say veterans

IIT-Madras director Kamakoti V and HCL founder Ajai Chowdhry said that packaging services — placing semiconductor wafers in casings and getting it ready for shipping -- would take off first, given its (the industry term for this is ATMP) relatively lower requirement in technology and investment.

from Tech-Economic Times https://ift.tt/ilq3pYk
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Poor data sharing undermining EU cyber defences, auditors say

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