Tuesday, May 24, 2022

Semiconductor packaging will take lead in supply chain localisation, say veterans

IIT-Madras director Kamakoti V and HCL founder Ajai Chowdhry said that packaging services — placing semiconductor wafers in casings and getting it ready for shipping -- would take off first, given its (the industry term for this is ATMP) relatively lower requirement in technology and investment.

from Tech-Economic Times https://ift.tt/ilq3pYk
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MDR on UPI will hit businesses, not users: FM Nirmala Sitharaman hits back at Congress' Jairam Ramesh

Sitharaman accused the opposition leader of "spreading a canard" and clarified that MDR "applies only on the merchants and no...